History

Founded in 1997 as Dongbu Electronics,
DB HiTek has grown into a specialized foundry with
world-class analog and power semiconductor technologies,
beginning with the industry’s first development of
0.18μm BCDMOS process technology.

DB HiTek’s journey of challenge and
innovation continues.

current - 2022

current - 2022

Leading Innovation
in Next-Generation Semiconductor Technology

Leading Innovation
in Next-Generation Semiconductor Technology

In 2022, DB HiTek achieved record-high revenue for the fourth consecutive year and ranked second in operating margin (46%) among KOSPI-listed companies in Korea.

DB HiTek later spun off its design division as DB GlobalChip to strengthen specialization by business area and is now taking the lead in next-generation semiconductor innovation through advanced and differentiated technologies.

  • 2025
    • Development of 0.18μm VD180LV Process
    • Development of 0.13μm XA BCD Process
    • Development of 0.18μm LV BCD Gen4 Process
    • Development of SJMOSFET Gen3.5 Process
  • 2023
    • Spun off DB GlobalChip (Design Division)
    • Announced management innovation plan to enhance shareholder value
    • Developed 0.18μm Analog CMOS Gen2 process
  • 2022
    • Achieved record-high revenue and operating profit
    • Published first Sustainability Report
    • Developed the UHV 900 process

2021 - 2017

Strengthening Technological Competitiveness
with High-Growth, High-Value Products

Strengthening Technological Competitiveness
with High-Growth, High-Value Products

DB HiTek, which possesses world-class expertise in analog and power semiconductors, changed its name from Dongbu HiTek in 2017. Since then, the company has focused on high-growth, high-value products to further strengthen its unrivaled technological competitiveness.

  • 2021
    • Development of 0.13um RF SOI Gen3 Process
    • Development of SJ MOSFET Gen3 Process
  • 2020
    • Development of 0.18um XA (X advanced) BCDMOS Process
    • Development of 0.13um RF SOI Gen2 Process
    • Development of Specialty CIS (Global shutter, SPAD) Process
  • 2019
    • Development of 0.13um LV BCDMOS Gen2 Process
    • Development of 0.13um RF SOI Process
  • 2018
    • Development of 0.13um HV BCD Process
  • 2017
    • Renamed to DB HiTek (formerly Dongbu HiTek)
    • Development of 0.18um HV(High voltage) BCDMOS Gen3 Process
    • Development of 90nm CIS & MS Process
    • Development of SJ MOSFET Gen2 Process

2016 - 2008

Building Global Competitiveness
Through Innovative Semiconductor Processes

Building Global Competitiveness
Through Innovative Semiconductor Processes

In 2008, DB HiTek became the first company in the world to develop 0.18μm BCDMOS process technology, establishing itself as a leading semiconductor company in South Korea.

Despite facing financial difficulties while expanding its semiconductor business without government support—an area that requires significant capital investment—DB HiTek successfully returned to operating profit in 2014 through financial restructuring, including a personal capital contribution by Founder Kim Jun-ki experts, and the enhancement of its technological competitiveness.

  • 2016
    • Achieved 1 million analog & power wafer shipments
    • Development of Advanced 0.18um BCDMOS Process
    • Development of 0.11um RF HRS (High Resistivity Substrate) Process
  • 2014
    • Turned to operating profit
    • Development of 0.13um BCDMOS & 0.11um Low Noise CMOS Process
  • 2011
    • Development of 0.18um Analog CMOS Process
    • Development of 0.18um HP (High Precision) Process
  • 2010
    • Development of 0.11um Mixed-Signal & RF Process
    • Development of 0.18um LV(Low Voltage) BCDMOS Gen2 Process
  • 2008
    • Developed industry’s first 0.18μm BCDMOS process
    • Developed and mass-produced LCD driver chips

2007 - 1997

Foundation of DB HiTek’s Predecessor,
Dongbu Electronics

Foundation of DB HiTek’s Predecessor,
Dongbu Electronics

In 1997, DB Group officially entered the semiconductor business by establishing a semiconductor manufacturing company based on its accumulated experience and technology in semiconductor materials.

Since then, it has actively expanded its business by forming strategic partnerships with global semiconductor leaders such as Texas Instruments in the U.S. and Toshiba in Japan for technology transfer and product supply, and by acquiring Anam Semiconductor.

  • 2007
    • Developed 0.11μm CIS process
  • 2004
    • Launched commercial foundry production with 0.13μm process
    • Developed 0.18μm CIS process
  • 2001
    • Fab2 begins commercial production
  • 2000
    • Completed Fab2 (Sangwoo Campus)
  • 1997
    • Fab1 begins commercial production
    • Established Dongbu Electronics and completed Fab1 (Bucheon Campus)

1996 - 1983

DB Group’s Entry into the Semiconductor Industry

DB Group’s Entry into the Semiconductor Industry

DB Group (formerly Dongbu Group) entered the semiconductor wafer business in 1983 by establishing Kosil Co., Ltd. (now SK Siltron). In 1992, it became the second company in the world to develop high-purity polycrystalline silicon, a key material for semiconductor wafers.

  • 1992
    • Achieved the industry’s second development of high-purity polycrystalline silicon
  • 1983
    • DB Group enters the semiconductor wafer business.

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