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CIS
CMOS Image Sensor

CMOS Image Sensors, Capturing the World Through Technology

CIS (CMOS Image Sensors) are key components that convert light entering through a lens into electrical signals, enabling electronic devices to generate images.

DB HiTek provides CMOS image sensor processes ranging from 0.18μm to 90nm, based on low-power and low-noise technologies. These processes have demonstrated stable performance across a wide range of products.

DB HiTek specializes in customized CIS and supports tailored R&D, offering a wide range of options such as CIF, VGA, and megapixel formats. These are based on 0.18μm to 90nm CIS processes that incorporate N+/PW photodiodes, color filters, and microlens technology. Mass production is carried out for a variety of CIS chips tailored to both mobile and non-mobile applications. Customized pixel development and process optimization through skilled engineering are also offered to meet diverse application needs.

Process

Ranging from 0.18μm to 0.09μm, Based on Low-Power and Low-Noise Technologies

0.18μm: 3 Level Aluminum Process (up to M6) 0.18um Generic Process Own Library for 0.18um Process Dual Gate Oxide Process Pixel & I/O : 3.3V, Core : 1.8V Dark Current Reduction Process Thin BEOL Height Stitching available

0.13μm: 3 Level Aluminum Process Own Library for 0.13um Process Dual Gate Oxide Process Pixel & I/O : 3.3V, Core : 1.5V Dark Current Reduction Process Thin BEOL Height at Pixel area Minimized photo layers

0.11μm: 3 Level Aluminum Process(up to M6) M0 local interconnection (only pixel area) Own Library for 0.11um Process Dual Gate Oxide Process Pixel & I/O : 2.8V/3.3V, Core : 1.5V Dark Current Reduction Process Thin BEOL Height Optimized Photo Layers Option process: 8fF MIM, Optimized Light guide process BSI available Stitching available

0.09μm: 3 Level Aluminum Process(up to M6) M0 local interconnection (only pixel area) Own Library for 0.09um Process Dual Gate Oxide Process Pixel & I/O : 2.8V/3.3V, Core : 1.2V Dark Current Reduction Process Thin BEOL Height Optimized Photo Layers Option process: 8fF MIM, Optimized Light guide process BSI available

Application-Specific
Solutions

DB HiTek offers a wide range of process options designed for both high performance and cost efficiency, covering all CIS application areas from large to small pixels and from mobile devices to specialized sensors.

With accumulated expertise and diverse technologies such as ToF, X-ray, global shutter, TDI sensors, and SPAD, DB HiTek provides optimized solutions. The company also plans to continue expanding process development into emerging areas such as SWIR.