DB HiTek

Since 2000, LB Semicon has led the bumping business by leveraging extensive mass-production experience and strong technological expertise, and today operates the largest bump production capacity in Korea. In addition, LB Semicon provides a one-stop turnkey service covering the full scope of the Display Driver IC business through its integrated solutions, including COF package services, creating enhanced value for its customers.
More recently, LB Semicon has initiated full-scale power semiconductor backend services and is aggressively expanding this business as a core driver of mid- to long-term growth.

JCET Group is a global leader in integrated circuit back-end manufacturing and technology services. We provide comprehensive turnkey solutions, including semiconductor package integration design, wafer probing, bumping, assembly, final testing, and global drop shipments.
Utilizing advanced wafer-level packaging, 2.5D/3D packaging, System-in-Package solutions, and reliable flip chip and wire bonding technologies, we support a wide range of applications, including automotive, artificial intelligence, high-performance computing, storage, communication, smart devices, industrial and medical sectors, and power and energy.
With cutting-edge R&D centers in China and Korea, and manufacturing facilities across China, Korea, and Singapore, we deliver efficient supply chain solutions and maintain close collaboration with our global customers.