ShuttleChip(MPW)
The ShuttleChip (MPW : Multi Project Wafer) program allows customers to perform trial production of their semiconductor designs on a shared wafer, helping to verify the feasibility of commercial manufacturing. It reduces the cost burden for fabless companies and supports close collaboration between fabless and foundry partners across the entire semiconductor development process, from early-stage design and prototyping to mass production.
No.: Tape-out Start Date
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| Process | Process Detail | Tech | Fab | 1Q | 2Q | 3Q | 4Q | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Jan | Feb | Mar | Apr | May | Jun | Jul | Aug | Sep | Oct | Nov | Dec | ||||
| Analog/ BCD |
AN07 | 0.18µm | Fab1 or Fab2 |
28 | 25 | 25 | 29 | 27 | 24 | 29 | 26 | 30 | 28 | 25 | |
| AN180 | |||||||||||||||
| HP180 | |||||||||||||||
| BD180LV | |||||||||||||||
| BD180MV | |||||||||||||||
| BD180XH | |||||||||||||||
| BD180XA | |||||||||||||||
| AN180 | 28 | 25 | 27 | 29 | 26 | 30 | 25 | ||||||||
| BD180LV | |||||||||||||||
| BD180XH | |||||||||||||||
| BD180XA | |||||||||||||||
| BCD | VD180LV | 0.18µm | Fab1 | 02 | 04 | ||||||||||
| Analog/ BCD |
BD180LVA | 0.15µm | Fab1 or Fab2 |
11 | 15 | 10 | 12 | 14 | |||||||
| BD180LVB | |||||||||||||||
| AN180 Gen2 | |||||||||||||||
| BCD | BD180LVA | 0.15µm | 11 | 15 | 11 | ||||||||||
| Analog/ BCD/SOI | BD130 | 0.13µm | Fab2 | 25 | 29 | 24 | 26 | 28 | 16 | ||||||
| RS13 | |||||||||||||||
| Mixed Signal / RF HRS | 0.11µm | Fab2 | 04 | 02 | |||||||||||
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